Fabrication and characterisation of microscale hemispherical shell resonator with diamond electrodes on the Si substrate Article

Liu, Zhaoyang, Zhang, Weiping, Cui, Feng et al. (2019). Fabrication and characterisation of microscale hemispherical shell resonator with diamond electrodes on the Si substrate . 14(6), 674-677. 10.1049/mnl.2018.5601

Open Access

cited authors

  • Liu, Zhaoyang; Zhang, Weiping; Cui, Feng; Tang, Jian; Zhang, Yuying

authors

publication date

  • May 29, 2019

keywords

  • 0 mum
  • 0 nm
  • 3 kHz
  • 8 mm
  • Boron-doped polycrystalline diamond
  • Materials Science
  • Materials Science, Multidisciplinary
  • Nanoscience & Nanotechnology
  • Science & Technology
  • Science & Technology - Other Topics
  • Si
  • Si substrate
  • Technology
  • boron
  • capacitive detection transducers
  • capacitive sensors
  • damping
  • degenerate modes
  • diamond
  • electrodes
  • elemental semiconductors
  • fabrication process
  • frequency 81
  • full-symmetric microscale hemispherical resonator gyroscopes
  • gyroscopes
  • hemisphere mould
  • integrated diamond electrodes
  • integrated electrodes
  • integrated electrostatic excitation
  • microfabrication
  • microhemispherical resonator
  • micromechanical resonators
  • microsensors
  • millimetre-scale 3D hemispherical shell resonator
  • mode matching
  • moulding
  • self-aligned fabrication method
  • silicon
  • silicon substrate
  • size 0
  • size 2
  • size 3
  • surface roughness
  • thermo-elastic damping
  • three-dimensional microstructure hemispherical shell

Digital Object Identifier (DOI)

publisher

  • INST ENGINEERING TECHNOLOGY-IET

start page

  • 674

end page

  • 677

volume

  • 14

issue

  • 6