Novel high-temperature, high-power handling all-Cu interconnections through low temperature sintering of nanocopper foams Conference

Shahane, Ninad, Mohan, Kashyap, Raj, Pulugurtha Markondeya et al. (2016). Novel high-temperature, high-power handling all-Cu interconnections through low temperature sintering of nanocopper foams . 829-836. 10.1109/ECTC.2016.352

cited authors

  • Shahane, Ninad; Mohan, Kashyap; Raj, Pulugurtha Markondeya; Smet, Vanessa; Tummala, Rao; Antoniou, Antonia; Behera, Rakesh

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

keywords

  • AU
  • DISSOLUTION
  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • GOLD CATALYSTS
  • JOINTS
  • METHANOL
  • MONOLITHIC NANOPOROUS COPPER
  • MORPHOLOGY
  • Nanocopper foam
  • PASTE
  • PLATINUM
  • Science & Technology
  • Technology
  • automotive electronics
  • coarsening
  • densification
  • interconnections
  • nanoporous

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 829

end page

  • 836