Copper interconnections for high performance and fine pitch flipchip digital applications and ultra-miniaturized RF module applications Conference

Tummala, Rao R, Raj, P Markondeya, Aggarwal, Ankur et al. (2006). Copper interconnections for high performance and fine pitch flipchip digital applications and ultra-miniaturized RF module applications . 102-+. 10.1109/ECTC.2006.1645632

cited authors

  • Tummala, Rao R; Raj, P Markondeya; Aggarwal, Ankur; Mehrotra, Gaurav; Koh, Sau Wee; Bansal, Shubhra; Tiong, Tan Teck; Ong, CK; Chew, Jimmy; Vaidyanathan, Kripesh; Rao, Vempati Srinivasa

authors

date/time interval

  • January 1, 2006 -

publication date

  • January 1, 2006

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 56th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 102

end page

  • +