Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging Conference

Tummala, RR, Raj, PM, Atmur, S et al. Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging . 13(1-3), 417-422. 10.1007/s10832-004-5135-6

Industry Collaboration

cited authors

  • Tummala, RR; Raj, PM; Atmur, S; Bansal, S; Banerji, S; Liu, FH; Bhattacharya, S; Sundaram, V; Shinotani, KI; White, G

authors

date/time interval

  • August 3, 2003 -

keywords

  • FR4
  • Materials Science
  • Materials Science, Ceramics
  • Printed Wiring Board
  • Science & Technology
  • SiC
  • System-On-Package
  • Technology
  • electronic packaging
  • flip chip
  • high density packaging
  • high density wiring
  • reliability

Location

  • MA, MIT, Cambridge

Digital Object Identifier (DOI)

Conference

  • International Conference on Electroceramics (ICE 2003)

publisher

  • SPRINGER

start page

  • 417

end page

  • 422

volume

  • 13

issue

  • 1-3