Metal-polymer composite interconnections for ultra fine-pitch wafer level packaging Article

Aggarwal, Ankur O, Raj, P Markondeya, Tummala, Rao R. (2007). Metal-polymer composite interconnections for ultra fine-pitch wafer level packaging . IEEE TRANSACTIONS ON ADVANCED PACKAGING, 30(3), 384-392. 10.1109/TADVP.2007.901776

Industry Collaboration

cited authors

  • Aggarwal, Ankur O; Raj, P Markondeya; Tummala, Rao R

authors

publication date

  • August 1, 2007

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology
  • composite
  • interconnections
  • low stress
  • polymer column
  • stress relief
  • wafer level packaging

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 384

end page

  • 392

volume

  • 30

issue

  • 3