Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly Conference

Kumbhat, N, Raj, PM, Pucha, RV et al. (2004). Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly . 1843-1850. 10.1109/ECTC.2004.1320370

cited authors

  • Kumbhat, N; Raj, PM; Pucha, RV; Sundaram, V; Doraiswami, R; Bhattacharya, S; Hayes, S; Atmur, S; Sitaraman, SK; Tummala, RR

authors

date/time interval

  • February 3, 2004 -

publication date

  • January 1, 2004

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 54th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1843

end page

  • 1850