First Demonstration of Copper-plated Through-Package-Via (TPV) Reliability in Ultra-thin 3D Glass Interposers with Double-side Component Assembly Conference

Demir, Kaya, Gandhi, Saumya, Ogawa, Tomonori et al. (2015). First Demonstration of Copper-plated Through-Package-Via (TPV) Reliability in Ultra-thin 3D Glass Interposers with Double-side Component Assembly . 666-671.

Industry Collaboration International Collaboration

cited authors

  • Demir, Kaya; Gandhi, Saumya; Ogawa, Tomonori; Pucha, Raghu; Smet, Vanessa; Sundaram, Venky; Raj, P Markondeya; Tummala, Rao

authors

date/time interval

  • May 26, 2015 -

publication date

  • January 1, 2015

keywords

  • Computer Science
  • Computer Science, Theory & Methods
  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Conference

  • IEEE 65th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 666

end page

  • 671