"Zero-Undercut" Semi-Additive Copper Patterning - A Breakthrough for Ultrafine-line RDL Lithographic Structures and Precision RF Thinfilm Passives Conference

Raj, P Markondeya, Nair, Chandrasekharan, Lu, Hao et al. (2015). "Zero-Undercut" Semi-Additive Copper Patterning - A Breakthrough for Ultrafine-line RDL Lithographic Structures and Precision RF Thinfilm Passives . 402-405.

cited authors

  • Raj, P Markondeya; Nair, Chandrasekharan; Lu, Hao; Liu, Fuhan; Sundaram, Venky; Hess, Dennis W; Tummala, Rao

authors

date/time interval

  • May 26, 2015 -

publication date

  • January 1, 2015

keywords

  • CU
  • Computer Science
  • Computer Science, Theory & Methods
  • Engineering
  • Engineering, Electrical & Electronic
  • SILICON
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Conference

  • IEEE 65th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 402

end page

  • 405