Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel Article

Kim, Youngwoo, Cho, Jonghyun, Kim, Jonghoon J et al. (2016). Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel . IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 58(6), 1747-1759. 10.1109/TEMC.2016.2587824

Industry Collaboration International Collaboration

cited authors

  • Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao; Kim, Joungho

authors

publication date

  • December 1, 2016

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Glass
  • SILICON
  • Science & Technology
  • Technology
  • Telecommunications
  • high-speed channel
  • interposer
  • measurement
  • power distribution network (PDN)
  • resonance
  • through glass via (TGV)

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 1747

end page

  • 1759

volume

  • 58

issue

  • 6