Reliability of Copper Through-Package Vias in Bare Glass Interposers Article

Demir, Kaya, Armutlulu, Andac, Sundaram, Venky et al. (2017). Reliability of Copper Through-Package Vias in Bare Glass Interposers . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 7(6), 829-837. 10.1109/TCPMT.2017.2691407

International Collaboration

cited authors

  • Demir, Kaya; Armutlulu, Andac; Sundaram, Venky; Raj, P Markondeya; Tummala, Rao R

authors

publication date

  • June 1, 2017

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • FABRICATION
  • Failure mechanism analysis
  • LOW-COST
  • Materials Science
  • Materials Science, Multidisciplinary
  • PITCH
  • SILICON
  • Science & Technology
  • Technology
  • finite-element modeling (FEM)
  • glass interposer
  • reliability
  • through-package vias (TPVs)

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 829

end page

  • 837

volume

  • 7

issue

  • 6