Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions Conference

Watanabe, Atom O, Lin, Tong-Hong, Raj, P Markondeya et al. (2018). Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions . 2026-2031. 10.1109/ECTC.2018.00304

Industry Collaboration International Collaboration

cited authors

  • Watanabe, Atom O; Lin, Tong-Hong; Raj, P Markondeya; Sundaram, Venky; Tentzeris, Manos M; Tummala, Rao R; Ogawa, Tomonori

authors

date/time interval

  • May 29, 2018 -

publication date

  • January 1, 2018

keywords

  • 5G communications
  • Antenna in package
  • Engineering
  • Engineering, Electrical & Electronic
  • Glass packaging
  • IN-PACKAGE
  • Low loss interconnects
  • Microvia
  • Science & Technology
  • Technology
  • Transmission lines
  • Yagi-Uda antenna

Location

  • CA, San Diego

Digital Object Identifier (DOI)

Conference

  • 68th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 2026

end page

  • 2031